Product Categories
Browse FLASHBOND categories by cure path, chemistry, and handling profile.
Dual cure
Use these grades when parts need a short placement window after UV exposure and a room-temperature or low-heat finish cure.
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Lower-viscosity dual-cure UV epoxy for fixturing and assembly
Dual-cure UV epoxy with controlled open time for assembly
Direct UV cure
Use these grades when UV or LED light reaches the bondline and the assembly needs a rigid cationic epoxy.
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Low-viscosity UV epoxy with broad substrate adhesion
Low-viscosity, water-clear UV epoxy that stays clear at temperature
Low-viscosity UV epoxy with high Tg and rigidity
Filled and thixotropic
Use these grades when the adhesive needs body, bead control, lower shrinkage, or component protection.
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Thixotropic UV epoxy with magenta-to-clear cure indicator
Filled, low-shrinkage UV epoxy for high-temperature service
Filled glob-top UV epoxy for chip encapsulation
UV plus heat
Use this grade when UV light can fixture the exposed area but heat must finish cure in shadowed areas.
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Hybrid UV plus thermal cure for shadowed areas
Flexible UV cure
Use these grades when the bond needs flexibility, impact tolerance, or a non-sag paste for plastics and mixed substrates.
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Tough, flexible UV/LED bond for mixed substrates
Non-sag UV-cure paste for plastics and metals