Encapsulation-first design
It is designed for glob-top, dam-and-fill, and smart-card chip module work.
FLASHBOND product
UV-5403S
UV cure cationic epoxy, filled
Filled glob-top UV epoxy for chip encapsulation
UV-5403S is a filled, low-shrinkage light cure epoxy with low CTE and high bond strength. It is designed as a glob top encapsulant for smart card chip modules, with solvent-free chemistry, high ionic purity, moisture resistance, and fast LED/UVA cure.
In plain English
UV-5403S is a filled encapsulant for glob-top and chip protection work with fast LED/UVA cure and low-shrinkage behavior.
Product fit
Why buyers choose this grade
Fast 365 nm LED response
Reference cure is listed at 30 seconds with a 365 nm LED source, making it suitable for compact LED equipment.
Cleaner electronics profile
High ionic purity, halogen-free status, and moisture resistance are all useful signals for component protection work.
Good fit for
- Smart-card modules, chip protection, glob-top work, and dam-and-fill processes
- Encapsulation jobs that need lower shrinkage and low ionic content
- Programs that need a filled epoxy tuned for LED/UVA curing instead of a general bondline adhesive
Things to confirm first
- This is an encapsulant-style product; choose a clear cationic grade for a transparent structural bond.
- Its 150°C operating window is strong, but not as high as the most heat-focused rigid grades.
Datasheet applications
- Glob top
- Dam and fill
- General encapsulant
Key features
- RoHS and REACH compliant
- Halogen free (IEC 61249-2-21)
- High bond strength
- Fast UV/LED cure
Recommended substrates
- Metals
- Ceramics
- Glass
Packaging
- Syringes
- Bulk
Technical data
Material profile at a glance.
Typical values for reference only. Use these material, cured-state, and cure-window values to compare fit before confirming specifications.
Uncured material
| Chemical class | Cationic epoxy |
|---|---|
| Appearance | Off white |
| Viscosity at 25°C | 5,000 to 8,000 cps |
| Density | 1.37 g/mL |
Cured material
| Glass transition (Tg) | 72°C |
|---|---|
| Hardness | Shore D 78 |
| Ultimate tensile strength | 5,000 PSI |
| Elongation at break | 1 to 3% |
| Operating temperature | -55°C to 150°C |
| Volume resistivity | 1 x 10¹⁴ Ω-cm |
Cure overview
| Wavelength | 365 nm LED, UVA |
|---|---|
| Intensity | 100 to 300 mW/cm² |
| Reference cure | 30 seconds at 150 mW/cm² (365 nm LED) |
Shelf life and storage
Store at 2°C to 10°C, 6 month shelf life. Material is light and heat sensitive.