Controlled assembly window
Pre-activation at 365 or 405 nm creates an intentional open time instead of forcing instant final cure.
FLASHBOND product
UV-5608DC
UV/LED cure dual-cure cationic epoxy
Dual-cure UV epoxy with controlled open time for assembly
UV-5608DC is a dual-cure light cure epoxy. Pre-activation gives a 45 to 60 second open time for part placement; final cure follows at room temperature or with low-temperature heat. It is a low-shrinkage, low-outgassing grade for optics, connectors, fibers, lenses, prisms, and electronic components.
In plain English
UV-5608DC provides a dual-cure placement window with more body than UV-2910DC for connectors, lenses, and controlled-flow assemblies.
Product fit
Why buyers choose this grade
Good balance of flow and hold
Its 4,000 to 7,000 cps viscosity sits in the middle ground between low-viscosity wetting grades and non-sag pastes.
Built for precision bonds
Low shrinkage, low outgassing, and strong thermal and chemical resistance make it a strong option for higher-value assemblies.
Good fit for
- Optical and electronic assemblies that need 45 to 60 seconds of post-light placement time
- Connector, lens, and fiber builds that benefit from a slightly thicker epoxy
- Assemblies that need room-temperature cure backup or low-temperature heat assist
Things to confirm first
- This grade still needs the follow-up room-temperature or thermal cure stage to reach final properties.
- If you need very fast wicking into tight capillary gaps, the lower-viscosity dual-cure grade may be the better starting point.
Datasheet applications
- Optics bonding
- Connectors
- Fiber and lens bonding
- Electronic components
Key features
- Open-time pre-activation
- Low shrinkage
- Low outgassing
- Thermal and chemical resistance
Recommended substrates
- Glass
- Metals
- Ceramics
- Engineered plastics
Packaging
- Syringes
- Bulk
Technical data
Material profile at a glance.
Typical values for reference only. Use these material, cured-state, and cure-window values to compare fit before confirming specifications.
Uncured material
| Chemical class | Cationic epoxy |
|---|---|
| Viscosity at 25°C | 4,000 to 7,000 cps |
| Specific gravity | 1.12 |
Cured material
| Color | Translucent |
|---|---|
| Hardness | Shore D 75 |
| Glass transition (Tg) | 81°C |
| Linear shrinkage | 0.8% |
| Tensile strength | 3,000 PSI |
| Lap shear (Al/Al) | 2,500 PSI |
| Elongation at break | 7.6% |
| Water absorption (24 hr) | 0.15% |
| Service temperature | -55°C to 150°C |
| Dielectric strength | 420 V/mil |
| Volume resistivity | 1.0 x 10¹⁴ Ω-cm |
Cure overview
| Pre-activation | 100 to 150 mW/cm² at 365 or 405 nm, 6 to 8 s |
|---|---|
| Open time | 45 to 60 seconds |
| Full cure (after assembly) | 24 to 48 hours at room temperature |
| Direct full cure option | 20 to 30 s, or 250 to 400 mW/cm² for 5 to 8 s |
Shelf life and storage
Store in unopened container in a dry location. Optimal storage 10°C to 25°C; keep away from light.